There has been quite a lot of suspicion going on with whether Samsung would bake the Snapdragon 810 chipset in its next flagship. Moreover, the recent sources have claimed that the initial 90% of Samsung Galaxy S6 devices would come with the company’s home made Snapdragon 810 chipset. Additionally, Qualcomm is also struggling to work upon the heating issues with its octa-core Snapdragon 810 chipset. Recently LG came out as the first company to support this chipset in its newly launched LG G Flex 2. LG however claimed that it itself is able to work upon the heating issues with the chipset maybe with some software algorithm.
Now the recent report shows that chip making giant Qualcomm is working on a re-design of its chipset to come over with the heat emission issue and should come with a solution for this till March when Samsung is expected to launch its next flagship the Galaxy S6. It seems that Qualcomm need to work upon it soon as many smartphone manufacturers would want to launch their high-end flagships ahead this year.
However, Samsung may this as an opportunity to increase its base in chipset market with its Exynos CPUs. Check out our article that explains the in and out of the Snapdragon 810.
source: The Wall Street Journal