Qualcomm showcased the next upcoming Snapdragon 820 chipset in MWC (Mobile World Congres) which was held in March 2015 previously. Hopefully the chipset will be able to solve the overheating issue which plagued the predecessor Snapdragon 810 chipset.

Snapdragon 820 chipset is reported to be integrated with custom-designed 64-bit CPU cores called Kyro. If this information is correct then the cores will be clocked up to 3.0 GHz and will be manufactured using Samsung’s 14nm node manufacturing technology. With this information, it is hinted that Qualcomm will be partnering with Samsung instead of TSMC to manufacture its chipset. Beforehand, Qualcomm always partnered with TSMC to manufacture its chipset.

Some of the smartphone manufacturers which is going to test out the new chips are Sony, HTC and Xiaomi. Xiaomi is reported to use Snapdragon 820 chipset in the company’s next flagship smartphone Mi 5. The Xiaomi smartphone will be launched in October if everything going according to plan.

Since Snapdragon 820 is going to use Samsung’s 14nm node process which is the same process that Samsung did for the company’s own Exynos 7420 chipset and already being used for Galaxy S6 series, it seems like it is going to solve the overheating issue which found in Snapdragon 810. Snapdragon 810 was manufactured by TSMC on 20nm technology.

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