The modular smartphone concept from Google is still live and the latest news say that some its parts could likely be seen at the MWC 2015 event in Barcelona next month. At the event, round about fifty modular components are likely to be seen out of which we can expect few of them to be shown in complete working condition.
Last month, we say Google announcing the first Project Ara module Spiral 2. The Project Ara for modular smartphone is said to allow users to upgrade the RAM, camera, GPU, display, chipsets and other components wherein you can replace the old parts for new and still keep the same look. Earlier, Toshiba had also announced that the company had partnered with Einfochips for producing chips for the Project Ara handsets. Toshiba has confirmed that it soon to launch the Spiral 3 after which the Spiral 2 would be available to the customers.
The modules are said to be priced in between $50 and $500 and an effort would be made to make it reasonable to the users. Additionally, there have also been reports earlier that few modular parts of the Project Ara handsets would be hot-swappable. You can know about all the previous details about Project Ara here. In the meanwhile, check out the images for the project below.