LG G Flex 3 is rumored to be showcased in March 2016 which is a few months away. As Qualcomm’s Snapdragon 820 chipset is rumored to be released in December 2015, therefore, there is a speculation that the device will be powered up with the chipset. Another device which allegedly could be powered up by the same chipset will be Xiaomi Mi 5 and it is rumored to also be launched in March 2016.
According to a reliable source, it is mentioned that there will be no overheating issue with the newer chipset. Apart from the processor, LG G Flex 3 is also rumored to have a 6-inch QHD display screen with resolution of 1440 x 2560, a 4GB RAM, a 32GB internal storage which can be expanded further. There will be two cameras as per normal; the back camera is a 20.7MP while the front camera is an 8MP. On top of that the device comes with a fingerprint scanner which is going to be integrated with the home button.
LG G Flex 3 allegedly would have a metal body. However, there is no information whether the buttons would be arranged in a similar manner as its predecessor which all the control buttons was found at the back of the device. There is no official confirmation about the device specification currently. The official specification will be most probably released nearer to the launching date.