This year we are quite expecting the Cupertino giant to unveil its iPhone 6s and iPhone 6s Plus and currently the supply chain of the company has recently released out images that alleges to be the body and the interiors of the next-generation iPhone models. The interior reveals some of the mounting points which would be used for the motherboard. The earlier reports have claimed that Apple would be using a System in Package technology (SIP) along with a PCB for the next iPhone models. The use of SiP would save space that could allow Apple to have larger battery capacity.

Apple has recently filed an patent which makes the antenna lines look like a metal housing on the device, however these lines still appear on the images of this new housing similar to the one seen in the existing iPhone 6 and iPhone 6 Plus. The leaked images also reveal that Apple will not use the dual-camera sytem as rumored earlier. However, we can expect a bump in the rear camera to 12MP resolution from the 8MP one.

Both the iPhone 6s models are expected to be coming with ForceTouch feature that allows the user to interact with the screen differently based on different pressure levels. This feature has been currently used on the Apple Watch and can really prove to be a great sales driver even for the new iPhone models. Check out the leaked images below.

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source: 9to5Mac

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